Hyprez Conditioning Rings, Work Rings & Part Holding Devices

Description

Conditioning and Work Rings for the Ultimate in Surface Finish
Engis manufactures two types of conditioning rings for lapping applications.

Stainless Steel-Backed Ceramic Work Rings not only serve to charge diamond particles into the lapping plate, but also to hold the parts carriers in position. The rings are:

• highly resistant to corrosion
• available for 12”, 15”, 18”, 24”, 28”, 36” and 42” lapping plates
• backed with 304 stainless steel for greater tensile strength
  Diamond-Plated Conditioning Rings remove the previous layer of charged diamond, presenting a new face to be charged with fresh particles. They can also be used to bring the lapping plate back into its original flatness and parallelism. Hyprez diamond-plated conditioning rings are:
• engineered to consistently regenerate surface texture and flatness of composite lapping plates
• eliminate varying results usually associated with conventional abrasive reconditioning.
• available for lapping plates from 12” up to 42”
• designed specifically for Hyprez HY composite lapping plate maintenance
   

 Plate Sizes & Patterns

Standard sizes are as follows: 6″, 9″, 12″, 15″, 16″, 18″, 24″, 28″, 36″, 42″ and 48″ diameters. Special sizes are available on request. Square, spiral, concentric and radial grooves, as well as custom patterns, are available.

Engis Part Holding Devices
Small parts may be loaded into the ceramic work ring in bulk to completely fill the workstation area. Larger parts are primarily positioned inside the ceramic work rings using fiberglass, plastic or steel carriers.

• Hyprez Parts Carriers are designed to increase productivity while attaining precision surface flatness and finish. Available in fiberglass, conventional phenolic plastic and a range of other materials, in various diameters and thickness. Machining is available upon request.
• Hyprez Rubber Pads can be used with the carriers to apply even pressure to all parts by taking up excessive height differences between them. They are available in 1/2” thick soft rubber and 1/8” hard rubber.
   

Engis Wafer Bonding Systems

When the component to be lapped is very thin or flexible, wax mounting on a ceramic or stainless steel plate is advisable This bonding device actually fixes wafers and thin work pieces to the lapping carrier using wax-based adhesives under pressure and heat ensuring a uniform wax film thickness.