High-Precision Automatic Lapping System EJW-610IFN-2AL/CMP

High-Precision Automatic Lapping System EJW-610IFN-2AL/CMP

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Head Office: Ho Chi Minh City

  • Tel: +84 2839 778 269 / 3601 6797
  • Email: sales@lidinco.com
  • Add: 487 Cong Hoa Street, Ward 15, Tan Binh Dist, HCM City, Vietnam

Office: Bac Ninh City

  • Tel: +84 222 730 0180
  • Email: bn@lidinco.com
  • Add: 184 Binh Than Street, Vo Cuong Ward, Bac Ninh City, Vietnam
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EJW-610IFN-2AL/CMP is a high-precision automatic lapping system that is optimum for sapphire wafers or SiC wafers use in manufacturing LEDs and power devices that require high-precision lapping and polishing processes. This system is equipped with a high-precision facing unit and uses a lapping plate of maximum 610 mm (24”) in outer diameter. It allows simultaneous lapping of two wafers put into vacuum contact with the vacuum chuck by pressurizing, driving, and oscillating them. 


• Processing of up to 8” wafers 
• Clean and safe wafer handling with vacuum chucks 
• Use of a 2-axis motorized drive mechanism that allows high throughput as well as stable lapping and polishing 



• Automatic-sizing mechanism, mountable as an option 
• LCD touch-panel screen for easy operation 


• High-precision facing unit 
• Up to 10 recipes can be registered by the multi-step program 


System Model EJW-610IFN-2AL/CMP 
Lapping Plate Diameter Outer diameter ø610 mm (24″) 
x Inner diameter ø100 mm 
(Special specifications) 
Number of Pressure Heads Two heads 
Dimensions W2,000 mm x D2,000 mm x H2,000 mm 
Weight  1,300 kg 


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