Micro-manipulation probe station is applied in the technology of microchip processing, integrated circuit (IC). Semiconductor and passive electronic components located on the microchip are extremely small in size (from µm or less) that cannot be manipulated by normal ways. Therefore, micro-manipulation systems are needed to support inspection, repair, and maintenance.


The micro-manipulation system will receive physical signals from the internal points of the semiconductor device. The measuring station uses controllers that allow for precise positioning of thin needles on the surface of the semiconductor device. If the device is electrically excited, the signal received by the probe will be displayed on the oscilloscope or SMU. Because of this, micro-ops are often used in semiconductor fault analysis.

Operation Principle:

A micro-manipulation has a device to fix the wafer or die and uses a "stage" to locate the device precisely. The micro-manipulation station is placed on a flat surface, called a plat platen. The user installs probe arms and tips on the measuring station. Then use the microscope, mounted above the roller, to place the probes into the correct positions on the device. The device will be checked when all probes are placed in their correct positions. For wafers with multiple molds, the user can then lift the roller, which will separate the probes from the mold, then move the "stage" to the next die and repeat the operation. This step is usually very simple as the wafer molds are identical.

Order micro-manipulation probe stations in Vietnam:

Lidinco provides the micromanipulation probe stations for microchips, genuinely integrated circuits from leading brands in the world such as Micromanipulator, Cascade Microtech. In addition, we also have a team of experienced technicians giving free, dedicated consultation. Contact us now if you need support:


+84 28 3977 8269 / +8428 3601 6797

Email: sales@lidinco.com,  Skype: Lidinco

487 Cong Hoa Street, Ward 15, Tan Binh District, HCM City, Vietnam