Vitrox V810i S2 XLW Advanced 3D X-ray Inspection System

Name: Vitrox V810i S2 XLW Advanced 3D X-ray Inspection System
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Hotline: 0906.988.447

Liên hệ: Hồ Chí Minh

Điện thoại: (028).3977.8269
Email: sales@lidinco.com
Địa chỉ: 487 Cộng Hòa, Phường 15, Quận Tân Bình, TP. HCM

Liên hệ: Bắc Ninh, Hà Nội

Điện thoại: (0222).730.0180
Email: bn@lidinco.com
Địa chỉ: 184 Bình Than, Phường Võ Cường, TP. Bắc Ninh

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Largest Platform among all AXI Series which able to cater up to 52″ x 52″ board size.

System	V810i S2 Series
System controller	Integrated controller with 8 Core Intel Xeon processors
Operating system	Windows 10 (64 bits)
Test Development Environment
User interface	Microsoft Windows based software solution with easy-to-use GUI and password-protected user levels
Off-line test development software	Optional for off-line PC
CAD conversion tool	Support 4 different types of CAD in V810i software and optional software available to translate other CAD data to ViTrox’s format
Typical test development time	4 hours to 1.5 days to convert raw CAD file and develop application
Line Integration
Transport heights	865 mm – 1025 mm
Line communication standard	SMEMA, HERMES
Barcode readers	Compatible with most industry standard barcode readers
Performance Parameters *
Typical image acquisition rate	51.68 cm²/sec (8 in²/sec) at 19um
False Call rate	500 – 1000 ppm
Minimum features detection capability
Joint pitch¹	0.3 mm and above
Short width²	0.045 mm
Solder thickness	0.0127 mm
Allowable Panel Characteristics **	V810i S2 XLW
Maximum PCB Size (L x W)	1320.8mm x 1320.8mm (52″ x 52″)
Minimum PCB Size (L x W)	127mm x 127mm (5″ x 5″)
Maximum PCB inspectable area	1320.8mm x 1300.48mm (52″ x 51.2″) *Dual Stage Inspection with External Rotator
Maximum PCB thickness	10mm (393 mils)
Minimum PCB thickness	1.5mm (60 mils)
PCB warp	<2mm downward, 1mm upwards (without PSP); <3mm downward, <1.5mm upwards (with PSP)
Maximum PCB weight	25kg
Top Clearance of PCB	50 mm @ 19 µm 31 mm @ 15 µm 14 mm @ 11 µm (Calculated from Board Top surface)
Bottom Clearance of PCB	80 mm
PCB edge clearance	10 mm
100% Press-fit testability	Yes (With PSP2 / PSP2.1 feature)
PCB Temperature	40 Deg C
Power and Environmental
Power Supplies	200 – 240 VAC three phase; 380 – 415 VAC three phase wye (+/- 5) (50Hz or 60Hz)
Air requirement	828kPA (120psi) compressed air
System footprint (Width X Depth X Height)	3300mm x 3300mm x1990mm
Total system weight	~11000 kgs
*Note: 1. Panels are handled on width edges. Panels with edge cut outs may require the use of a carrier. 2. Maximum panel size dimensions and weight must include carrier if applicable 3. Smaller panels are possible with the use of panel carriers. 4. With panels of this thickness, imaging results can be affected by PCBA layout. 5. Measured from the bottom of the panel including a maximum warp.Note: 1. Assuming pad width is 50% of pitch. 2. The reported values for minimum feature detection assume that the feature is in a single plane of focus and that there are no X-ray absorbers in the X-ray path or in the immediate area of the feature other than those found in a typical multi-layer printed circuit board. #2×2 binning camera configuration. Hardware upgrade is required on old system.