LƯỠI DAO CẮT – GIẤY CẮT WAFERING BLADES – DIAMOND RESIN BOND Allied Hight Tech 60-200xx

WAFERING BLADES – DIAMOND RESIN BOND

tick sản phẩm Manufacturer
tick sản phẩm Model
  Allied High Tech
  Wafering Blade – Diamond Resin Bond
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  • Description
  • Datasheets

Description

Diamond resin bond blades are composed of an inner metal core and an outer rim. The rim consists of resin mixed with abrasive, cured under high temperature and pressure to bond the matrix together. Resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials.
Recommended for cutting hard, brittle or delicate materials including ceramics, carbides, composites and exotic metals where low heat generation or improved surface finish is desired. Most commonly used at higher (>1000 RPM) speeds.

Specifications

60-20069 Wafering Blade, Diamond Resin Bond, 4″ x .020″ x .5″ (102 x .51 x 12.7 mm)
60-20074 Wafering Blade, Diamond Resin Bond, 5″ x .020″ x .5″ (127 x .51 x 12.7 mm)
60-20079 Wafering Blade, Diamond Resin Bond, 6″ x .020″ x .5″ (152 x .51 x 12.7 mm)
60-20086 Wafering Blade, Diamond Resin Bond, 7″ x .025″ x .5″ (178 x .64 x 12.7 mm)
60-20088 Wafering Blade, Diamond Resin Bond, 8″ x .030″ x .5″ (203 x .76 x 12.7 mm)