WAFERING BLADES – DIAMOND RESIN BOND

WAFERING BLADES – DIAMOND RESIN BOND

SKU:
Diamond Resin Bond
Warranty:
N/A
Price: Contact
  • Type Sectioning Consumable:
  • Blade diameter:
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Specification

Data is being updated

Description

Diamond resin bond blades are composed of an inner metal core and an outer rim. The rim consists of resin mixed with abrasive, cured under high temperature and pressure to bond the matrix together. Resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials. 
Recommended for cutting hard, brittle or delicate materials including ceramics, carbides, composites and exotic metals where low heat generation or improved surface finish is desired. Most commonly used at higher (>1000 RPM) speeds. 

Specification 

60-20069 Wafering Blade, Diamond Resin Bond, 4″ x .020″ x .5″ (102 x .51 x 12.7 mm) 
60-20074 Wafering Blade, Diamond Resin Bond, 5″ x .020″ x .5″ (127 x .51 x 12.7 mm) 
60-20079 Wafering Blade, Diamond Resin Bond, 6″ x .020″ x .5″ (152 x .51 x 12.7 mm) 
60-20086 Wafering Blade, Diamond Resin Bond, 7″ x .025″ x .5″ (178 x .64 x 12.7 mm) 
60-20088 Wafering Blade, Diamond Resin Bond, 8″ x .030″ x .5″ (203 x .76 x 12.7 mm) 

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