WAFERING BLADES – DIAMOND RESIN BOND
WAFERING BLADES – DIAMOND RESIN BOND
SKU:
Diamond Resin Bond
Brand:
Warranty:
N/A
Price: Contact
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Type Sectioning Consumable:
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Blade diameter:
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- Tel: +84 2839 778 269 / 3601 6797
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- Tel: +84 222 730 0180
- Email: bn@lidinco.com
- Add: 184 Binh Than Street, Vo Cuong Ward, Bac Ninh City, Vietnam
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Specification
Data is being updated
Description
Diamond resin bond blades are composed of an inner metal core and an outer rim. The rim consists of resin mixed with abrasive, cured under high temperature and pressure to bond the matrix together. Resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials.
Recommended for cutting hard, brittle or delicate materials including ceramics, carbides, composites and exotic metals where low heat generation or improved surface finish is desired. Most commonly used at higher (>1000 RPM) speeds.
Specification
60-20069 | Wafering Blade, Diamond Resin Bond, 4″ x .020″ x .5″ (102 x .51 x 12.7 mm) |
60-20074 | Wafering Blade, Diamond Resin Bond, 5″ x .020″ x .5″ (127 x .51 x 12.7 mm) |
60-20079 | Wafering Blade, Diamond Resin Bond, 6″ x .020″ x .5″ (152 x .51 x 12.7 mm) |
60-20086 | Wafering Blade, Diamond Resin Bond, 7″ x .025″ x .5″ (178 x .64 x 12.7 mm) |
60-20088 | Wafering Blade, Diamond Resin Bond, 8″ x .030″ x .5″ (203 x .76 x 12.7 mm) |
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