Wafering Blade – Diamond Metal Bond

Name: Wafering Blade – Diamond Metal Bond
Brand: Allied High Tech
SKU: Diamond Metal Bond
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Diamond Metal Bond

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Allied High Tech

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Description

Diamond metal bond blades are composed of an inner metal core and an outer rim. The rim consists of metal mixed with abrasive, cured under high temperature and pressure to bond the matrix together. Metal bonding offers long life and durability.
High Concentration
Recommended for general laboratory sectioning, either low (<1000 RPM) or high (>1000 RPM) speeds.
Low Concentration
Recommended for sectioning very hard or brittle materials such as ceramics, silicon, glass and refractories where chipping and pullout need to be minimized. Most commonly used at lower (<1000 RPM) speeds.

60-20065	Wafering Blade, Diamond Metal Bond, High Concentration, 3″ x .006″ x .5″ (76 x .15 x 12.7 mm)
60-20070	Wafering Blade, Diamond Metal Bond, High Concentration, 4″ x .012″ x .5″ (102 x .31 x 12.7 mm)
60-20075	Wafering Blade, Diamond Metal Bond, High Concentration, 5″ x .015″ x .5″ (127 x .38 x 12.7 mm)
60-20080	Wafering Blade, Diamond Metal Bond, High Concentration, 6″ x .020″ x .5″ (152 x .51 x 12.7 mm)
60-20081	Wafering Blade, Diamond Metal Bond, High Concentration, 7″ x .025″ x .5″ (178 x .64 x 12.7 mm)
60-20084	Wafering Blade, Diamond Metal Bond, High Concentration, 8″ x .030″ x .5″ (203 x .76 x 12.7 mm)
60-20085	Wafering Blade, Diamond Metal Bond, Low Concentration, 3″ x .006″ x .5″ (76 x .15 x 12.7 mm)
60-20090	Wafering Blade, Diamond Metal Bond, Low Concentration, 4″ x .012″ x .5″ (102 x .31 x 12.7 mm)
60-20095	Wafering Blade, Diamond Metal Bond, Low Concentration, 5″ x .015″ x .5″ (127 x .38 x 12.7 mm)
60-20100	Wafering Blade, Diamond Metal Bond, Low Concentration, 6″ x .020″ x .5″ (152 x .51 x 12.7 mm)
60-20101	Wafering Blade, Diamond Metal Bond, Low Concentration, 7″ x .025″ x .5″ (178 x .64 x 12.7 mm)
60-20104	Wafering Blade, Diamond Metal Bond, Low Concentration, 8″ x .030″ x .5″ (203 x .76 x 12.7 mm)