Wafering Blade Allied High Tech 60-20075

Wafering Blade Allied High Tech 60-20075

SKU:
60-20075
Warranty:
N/A
25.200.000đ

(Price does not include VAT)

  • Type Sectioning Consumable:
  • Blade diameter:
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Specification

Data is being updated

Description

Diamond metal bond blades are composed of an inner metal core and an outer rim. The rim consists of metal mixed with abrasive, cured under high temperature and pressure to bond the matrix together. Metal bonding offers long life and durability.  

High Concentration

Recommended for general laboratory sectioning, either low (<1000 RPM) or high (>1000 RPM) speeds.  

Low Concentration

Recommended for sectioning very hard or brittle materials such as ceramics, silicon, glass and refractories where chipping and pullout need to be minimized. Most commonly used at lower (<1000 RPM) speeds.  

60-20065   Wafering Blade, Diamond Metal Bond, High Concentration, 3″ x .006″ x .5″ (76 x .15 x 12.7 mm)   
60-20070   Wafering Blade, Diamond Metal Bond, High Concentration, 4″ x .012″ x .5″ (102 x .31 x 12.7 mm)   
60-20075   Wafering Blade, Diamond Metal Bond, High Concentration, 5″ x .015″ x .5″ (127 x .38 x 12.7 mm)   
60-20080   Wafering Blade, Diamond Metal Bond, High Concentration, 6″ x .020″ x .5″ (152 x .51 x 12.7 mm)   
60-20081   Wafering Blade, Diamond Metal Bond, High Concentration, 7″ x .025″ x .5″ (178 x .64 x 12.7 mm)   
60-20084   Wafering Blade, Diamond Metal Bond, High Concentration, 8″ x .030″ x .5″ (203 x .76 x 12.7 mm)   
60-20085   Wafering Blade, Diamond Metal Bond, Low Concentration, 3″ x .006″ x .5″ (76 x .15 x 12.7 mm)   
60-20090   Wafering Blade, Diamond Metal Bond, Low Concentration, 4″ x .012″ x .5″ (102 x .31 x 12.7 mm)   
60-20095   Wafering Blade, Diamond Metal Bond, Low Concentration, 5″ x .015″ x .5″ (127 x .38 x 12.7 mm)   
60-20100   Wafering Blade, Diamond Metal Bond, Low Concentration, 6″ x .020″ x .5″ (152 x .51 x 12.7 mm)   
60-20101   Wafering Blade, Diamond Metal Bond, Low Concentration, 7″ x .025″ x .5″ (178 x .64 x 12.7 mm)   
60-20104   Wafering Blade, Diamond Metal Bond, Low Concentration, 8″ x .030″ x .5″ (203 x .76 x 12.7 mm)   

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