Standard Bonding Machine Engis HWB-18
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Head Office: Ho Chi Minh City
- Tel: +84 2839 778 269 / 3601 6797
- Email: sales@lidinco.com
- Add: 487 Cong Hoa Street, Ward 15, Tan Binh Dist, HCM City, Vietnam
Office: Bac Ninh City
- Tel: +84 222 730 0180
- Email: bn@lidinco.com
- Add: 184 Binh Than Street, Vo Cuong Ward, Bac Ninh City, Vietnam
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Specification
Data is being updated
Descriptions
The HWB series of bonding devices is a simple bonding device used in a wide range of fields.
The cooling table is equipped with a water jacket, which can be connected with a cooling circulation chiller to efficiently cool the waxing plate.
The adhesive pressure is pressed against the synchronized flat plate with a pressurized cylinder to suppress unevenness of wax and apply with good adhesion.
Accessories
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