Large Size Lapping Machine Engis EJW-610
Hotline: +84 906 988 447
Head Office: Ho Chi Minh City
- Tel: +84 2839 778 269 / 3601 6797
- Email: sales@lidinco.com
- Add: 487 Cong Hoa Street, Ward 15, Tan Binh Dist, HCM City, Vietnam
Office: Bac Ninh City
- Tel: +84 222 730 0180
- Email: bn@lidinco.com
- Add: 184 Binh Than Street, Vo Cuong Ward, Bac Ninh City, Vietnam
- Technical Counseling 100% Free
- Free Shipping For 3.000.000vnd Order
Specification
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Description
We have a full line-up of high-precision large-scale lapping machines of various sizes to meet the high-precision lapping required by the mass production of high-value-added parts and the increasing diameter of semiconductor wafers. In addition to the standard facing mechanism, the GNC series, in which the Z-axis is controlled by a servo motor, enables highly accurate flattening of the lapping plate by correcting the straightness of the facing slider and reprocessing of the spiral groove.
Accessories
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