Double Sided Lapping Machine Engis EJD-16B

Double Sided Lapping Machine Engis EJD-16B

SKU:
EJD-16B
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Warranty:
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Hotline: +84 906 988 447  

Head Office: Ho Chi Minh City

  • Tel: +84 2839 778 269 / 3601 6797
  • Email: sales@lidinco.com
  • Add: 487 Cong Hoa Street, Ward 15, Tan Binh Dist, HCM City, Vietnam

Office: Bac Ninh City

  • Tel: +84 222 730 0180
  • Email: bn@lidinco.com
  • Add: 184 Binh Than Street, Vo Cuong Ward, Bac Ninh City, Vietnam
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Specification

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Description

The EJD series is a double-sided polishing machine that supports a wide range of lapping and CMP processing of conventional abrasives, diamond abrasive, and fixed abrasive plates. The standard full safety cover can also be used in a semiconductor manufacturing environment. In addition, a wide variety of optional functions are available, such as real-time part thickness detection, actual pressure monitor and control, and low-pressure, low-speed descent control of the upper surface lapping platen, which are indispensable for simultaneous double-sided polishing of thin wafers.

Accessories

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