High Speed & Pressure Lapping Machine EJW-400HSP

High Speed & Pressure Lapping Machine EJW-400HSP

SKU:
EJW-400HSP
Brand:
Warranty:
N/A
Price: Contact
  • Platen Diameter:
  • Lapping Speed:
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  • Tel: +84 2839 778 269 / 3601 6797
  • Email: sales@lidinco.com
  • Add: 487 Cong Hoa Street, Ward 15, Tan Binh Dist, HCM City, Vietnam

Office: Bac Ninh City

  • Tel: +84 222 730 0180
  • Email: bn@lidinco.com
  • Add: 184 Binh Than Street, Vo Cuong Ward, Bac Ninh City, Vietnam
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Specification

Data is being updated

Description

The EJW‐400HSP series High Speed & High Pressure Fine Grinding Machine is the latest in the Trinity‐ α series of
machines. It is designed specifically for the fine grinding of polycrystalline diamond (PCD) compacts. The system is built on an extra sturdy base that ensures vibration free grinding. The main Spindle carrying the custom designed fine grinding wheel is controlled to react to grinding conditions. Each driven work spindle is speed and pressure programmable to adapt to grinding conditions. Thermal monitoring provides valuable in‐process data.

Specifications

Lap Plate SizeMaximum Φ380
Lap Plate SpeedVariable 30-1000 rpm
Main SpindleMechanical Bearing
Main Motor7.5Kw 200V 3Pole
Plate CoolingChiller Water Jacket
Work SizeMaximum 4 inch
Work Pressure CylinderΦ50*100 mm Stroke
Operation PanelLCD Soft Touch Panel
Elector ControlPLC
Program1 Step
Process Recipe10 Recipe
Work Drive Motor120W Independent Drive
Maximum 100 rpm (CCW)
Oscillation90W Variable Stroke
UtilityPower 200V 3Phase 63A  Air CDA 0.5 Mpa
Machine SizeW1200 x D1100 x H2835 (mm)
Weight1400kg

 

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