High Speed & Pressure Lapping Machine EJW-400HSP

High Speed & Pressure Lapping Machine EJW-400HSP

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Hotline: +84 906 988 447  

Head Office: Ho Chi Minh City

  • Tel: +84 2839 778 269 / 3601 6797
  • Email: sales@lidinco.com
  • Add: 487 Cong Hoa Street, Ward 15, Tan Binh Dist, HCM City, Vietnam

Office: Bac Ninh City

  • Tel: +84 222 730 0180
  • Email: bn@lidinco.com
  • Add: 184 Binh Than Street, Vo Cuong Ward, Bac Ninh City, Vietnam
  • Counseling Technical Counseling 100% Free
  • Shipping Free Shipping For 3.000.000vnd Order

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The EJW‐400HSP series High Speed & High Pressure Fine Grinding Machine is the latest in the Trinity‐ α series of
machines. It is designed specifically for the fine grinding of polycrystalline diamond (PCD) compacts. The system is built on an extra sturdy base that ensures vibration free grinding. The main Spindle carrying the custom designed fine grinding wheel is controlled to react to grinding conditions. Each driven work spindle is speed and pressure programmable to adapt to grinding conditions. Thermal monitoring provides valuable in‐process data.


Lap Plate Size  Maximum Φ380  
Lap Plate Speed  Variable 30-1000 rpm  
Main Spindle  Mechanical Bearing  
Main Motor  7.5Kw 200V 3Pole  
Plate Cooling  Chiller Water Jacket  
Work Size  Maximum 4 inch  
Work Pressure Cylinder  Φ50*100 mm Stroke  
Operation Panel  LCD Soft Touch Panel  
Elector Control  PLC  
Program  1 Step  
Process Recipe  10 Recipe  
Work Drive Motor  120W Independent Drive  
Maximum 100 rpm (CCW)  
Oscillation  90W Variable Stroke  
Utility  Power 200V 3Phase 63A  Air CDA 0.5 Mpa  
Machine Size  W1200 x D1100 x H2835 (mm)  
Weight  1400kg  



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