Vitrox V810i S2 XLL Advanced 3D X-ray Inspection System

Vitrox V810i S2 XLL Advanced 3D X-ray Inspection System

SKU:
V810 S2
Brand:
Warranty:
N/A
Price: Contact
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Specification

Data is being updated

Description  X-Ray V810i   

X-Ray V810i   World fastest and best test coverage AXI system for PCB SMT assembly line

Note

Software features

Visual linkage between API-AXI: Workflow and testing between Vitrox devices to optimize purchasing efficiency

Hardware Features

Advanced light grid sensor and protection sensors on the outside provide better protection during use
Latest panel movement mechanism (PIP) for ultimate edge protection
Various resolutions and motorized X-ray tubes optimize cycle efficiency

Curtain Sensor máy X-Ray Vitrox
Bảng điều khiển Panel in Place

Programming features

Supports up to 26 industrial CAD formats


8 programming steps to make work simpler from start to finish


More than 100 powerful algorithms and 22 preset steps for different operating environments


High working efficiency with few simple installation steps


Continuous Algorithm Improvement

X-Ray V810i   


Board Dimensions

V810i S2EX   

Máy X-Ray Vitrox V810i S2EX

V810i S2 XXL   

Máy X-Ray Vitrox V810i S2 XXL 1

V810 S2 XLT   

Máy X-Ray Vitrox V810i S2 XXL 1
Maximum panel size482mm X 610mm (19" x 24")457mm X 610mm (18" x 24")660mm X 965mm (26" x 38")
Minimum panel size76mm X 76mm (3" x 3")76mm X 76mm (3" x 3")76mm X 76mm (3" x 3")
Maximum panel inspectable area474mm X 610mm (18.7" x 24")434mm X 610mm (17.1" x 24")654mm X 965mm (25.75" x 38")
Maximum panel thickness7 mm (276 mils)4mm (160 mils), 7mm (280 mils) with carrier
3.5mm (140 mils) for Dual magnification system
12.7 mm (500 mils)
Minimum panel thickness0.5mm (20 mils)0.5mm (20 mils)0.5mm (20 mils)
Panel warpDownside < 3.0mm; Upside < 1.5mm (PSP)Downside < 2.0mm; Upside < 1.0mmDownside < 3.3mm; Upside < 3.3mm
Maximum panel weight4.5kg4.5kg15kg
Board top clearance50mm @ 23um resolution
38mm @ 19um resolution
11mm @ 11um resolution
(calculated from board top surface)
25mm @ 19um resolution
10mm @ 11um resolution
(calculated from belt surface)
25mm @ 19um resolution
15mm @ 13um resolution
(calculated from board top surface)
Board bottom clearance70mm50mm80mm
Panel edge clearance3mm3mm3mm
Panel width tolerance+/- 0.7mm+/- 0.7mm+/- 0.7mm
System resolution11um/19um/23um19um/11um19um /13um
100% Press-fit testabilityYes (With PSP2 feature)Yes (With PSP2 feature)Yes (With PSP2 feature)
Maximum acceptable panel temperatures40 Deg C40 Deg C40 Deg C
System Dimensions
Footprint1566mm (W) x 2145mm (D) x 1972mm (H)1520mm (W) x 1940mm (D) x 1890mm (H)2240mm (W) x 2460mm (D) x 1980mm (H)
Weight~3500kg~3300kg~5500kg

*Note:     
1. Assuming pad width is 50% of pitch.    
2. The reported values for minimum feature detection assume that the feature is in a single plane of focus and that there are no X-ray absorbers in the X-ray path or in the immediate area of the feature other than those found in a typical multi-layer printed circuit board. #2x2 binning camera configuration. Hardware upgrade is required on old system.   

**Note:     
1. Panels are handled on width edges. Panels with edge cut outs may require the use of a carrier.    
2. Maximum panel size dimensions and weight must include carrier if applicable.    
3. Smaller panels are possible with the use of panel carriers.    
4. With panels of this thickness, imaging results can be affected by PCBA layout.    
5. Measured from the bottom of the panel including a maximum warp.   

 

Board DimensionsV810 S2EXiV810 S2iV810 S2i XXL
Maximum panel size482mm X 610mm (19" x 24")457mm X 610mm (18" x 24")660mm X 965mm (26" x 38")
Minimum panel size76mm X 76mm (3" x 3")76mm X 76mm (3" x 3")76mm X 76mm (3" x 3")
Maximum panel inspectable area474mm X 610mm (18.7" x 24")434mm X 610mm (17.1" x 24")654mm X 965mm (25.75" x 38")
Maximum panel thickness7 mm (276 mils)4mm (160 mils), 7mm (280 mils) with carrier 3.5mm (140 mils) for Dual magnification system12.7 mm (500 mils)
Minimum panel thickness0.5mm (20 mils)0.5mm (20 mils)0.5mm (20 mils)
Panel warpDownside < 3.0mm; Upside < 1.5mm (PSP)Downside < 2.0mm; Upside < 1.0mmDownside < 3.3mm; Upside < 3.3mm
Maximum panel weight4.5kg4.5kg15kg
Minimum panel weight0.03kg0.03kg0.03kg
Clearance 
Board top clearance50mm @ 23um resolution 38mm @ 19um resolution 11mm @ 11um resolution (calculated from board top surface)25mm @ 19um resolution 10mm @ 11um resolution (calculated from belt surface)25mm @ 19um resolution 15mm @ 13um resolution (calculated from board top surface)
Board bottom clearance70mm50mm80mm
Panel edge clearance3mm3mm3mm
Panel width tolerance+/- 0.7mm+/- 0.7mm+/- 0.7mm
System resolution11um/19um/23um19um/11um19um /13um
100% Press-fit testabilityYes (With PSP2 feature)Yes (With PSP2 feature)Yes (With PSP2 feature)
Maximum acceptable panel temperatures40 Deg C40 Deg C40 Deg C
System Dimensions 
Footprint1566mm (W) x 2145mm (D)  x 1972mm (H)1520mm (W) x 1940mm (D)  x 1890mm (H)2240mm (W) x 2460mm (D)  x 1980mm (H)
Weight~3500kg~3300kg~5500kg

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