Máy mài phẳng dạng ngang EHG Series

Horizontal Grinding Machines for Advanced Material Wafers

tick sản phẩm Manufacturer
tick sản phẩm Model
tick sản phẩm Warranty
  Engis
  EHG Series
  12 monthly
Please call us now to get the best price and service
√ Hotline:
√ Mail:
√ Contact Form:
  028.3977.8269 / 028.3601.6797
sales@lidinco.com
  • Description

Description

The Engis EHG Horizontal Grinding machines are the perfect companion when back-thinning or preparing wafers such as sapphire, silicon carbide and gallium nitride. These unique systems are designed to economically surface grind, as well as back-side grind, LED wafers to the highest level of flatness and surface finish, saving time and labor costs.

Key Features
• PLC Based 12” Touch Screen Control Panel

• Independent Control of Grinding Wheel and Work
Piece Rotation
• Fixed or Oscillating Grinding Wheel Function
• Automatic Tool Wear Compensation
• Automatic Measuring and Thickness Control
• Data Management Capable

Additional Benefits
• User friendly set-up
• Easy wheel changing
• Rapid stock removal
• Increased throughput
• Compatible with 24” lapping machine