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Lưỡi cắt kim cương chính xác cao – Diamond Metal BondLưỡi cắt kim cương chính xác cao – Diamond Metal Bond

Wafering Blade – Diamond Metal Bond

tick sản phẩm Manufacturer
tick sản phẩm Model
  Allied High Tech
  Wafering Blade, Diamond Metal Bond
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  028.3977.8269 / 028.3601.6797
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  • Description
  • Dowload Datasheet

Description

4.1.1Diamond metal bond blades are composed of an inner metal core and an outer rim. The rim consists of metal mixed with abrasive, cured under high temperature and pressure to bond the matrix together. Metal bonding offers long life and durability.
High Concentration
Recommended for general laboratory sectioning, either low (<1000 RPM) or high (>1000 RPM) speeds.
Low Concentration
Recommended for sectioning very hard or brittle materials such as ceramics, silicon, glass and refractories where chipping and pullout need to be minimized. Most commonly used at lower (<1000 RPM) speeds.

60-20065 Wafering Blade, Diamond Metal Bond, High Concentration, 3″ x .006″ x .5″ (76 x .15 x 12.7 mm)
60-20070 Wafering Blade, Diamond Metal Bond, High Concentration, 4″ x .012″ x .5″ (102 x .31 x 12.7 mm)
60-20075 Wafering Blade, Diamond Metal Bond, High Concentration, 5″ x .015″ x .5″ (127 x .38 x 12.7 mm)
60-20080 Wafering Blade, Diamond Metal Bond, High Concentration, 6″ x .020″ x .5″ (152 x .51 x 12.7 mm)
60-20081 Wafering Blade, Diamond Metal Bond, High Concentration, 7″ x .025″ x .5″ (178 x .64 x 12.7 mm)
60-20084 Wafering Blade, Diamond Metal Bond, High Concentration, 8″ x .030″ x .5″ (203 x .76 x 12.7 mm)
60-20085 Wafering Blade, Diamond Metal Bond, Low Concentration, 3″ x .006″ x .5″ (76 x .15 x 12.7 mm)
60-20090 Wafering Blade, Diamond Metal Bond, Low Concentration, 4″ x .012″ x .5″ (102 x .31 x 12.7 mm)
60-20095 Wafering Blade, Diamond Metal Bond, Low Concentration, 5″ x .015″ x .5″ (127 x .38 x 12.7 mm)
60-20100 Wafering Blade, Diamond Metal Bond, Low Concentration, 6″ x .020″ x .5″ (152 x .51 x 12.7 mm)
60-20101 Wafering Blade, Diamond Metal Bond, Low Concentration, 7″ x .025″ x .5″ (178 x .64 x 12.7 mm)
60-20104 Wafering Blade, Diamond Metal Bond, Low Concentration, 8″ x .030″ x .5″ (203 x .76 x 12.7 mm)