First-aid Kits for Circuit Boards

Circuit Medic

First-aid Kits for Circuit Boards

• Manufucturer

    • Model

Circuit Medic


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  • Description


235-2102-5 Foam Swabs

Ideal for absorbing cleaning solvents, and applying color agents and epoxies.

115-9561 Color Agent, Green

Color Agent is a one part, air-drying, semi-paste ink commonly used for printing on hard surfaces including circuit board base materials. Color Agent contains petroleum distillates but is not considered hazardous and does not require special labeling. It can be used to tint the color of epoxy used for solder mask repair or circuit base board repair

Color agent may also be applied directly to the circuit board surface for color matching    

355-3102-5 Micro Probes

These super-sharp probes are manufactured from high quality stainless steel. They include a plastic grip for easy handling. These inexpensive, disposable probes are ideal for dispensing a minute amount of adhesive, and for micro-positioning of small objects.

Caution – Handle with care, tips are very sharp

235-2106-5 Cleaning Brushes

Disposable brush for use with solvents for cleaning and application of coatings.

115-3315-5 Mixing Picks

Unique mixing sticks have a paddle shape on one end for mixing, and sharp pick on the opposite end

235-3050 High Temp Tape Discs

High temperature tape discs are made of polyimide film with 1.5 mil of silicone adhesive that will not leave any residue. They can withstand temperatures of up to 500°F (260°C). Discs are .50″ (12.70 mm) diameter

310-2100 Wire Dots, Variety

Wire Dots are pre-cut shapes of a flexible polymer film coated with a high performance, electronics grade premanent pressure sensitive adhesive

235-1000-5 Alcohol Swab

Self-saturating foam swab filled with 99% Isopropyl alcohol. Ideal for removing flux residue and cleaning surfaces prior to soldering, coating and application of adhesives. Overall Length: 4.125″ (104.775mm). 

Squeeze handle until it “pops” releasing alcohol into the tip.

115-2706 Bonding Film

This sheet of Bonding Film is 1.50″ x 2.25″ (3.8 x 5.7 cm) in size. It is the same dry adhesive film we apply to circuit frames. Works great when you need to repair lifted pads and conductors without the need to use messy liquid adhesives.

115-3302 Circuit Bond Packs

Clear, low viscosity, superior strength epoxy, precisely measured out into two-compartment plastic packages so it’s easy to use and there’s no measuring

Circuit Bond Application Instructions

  1. Circuit Bond has a working pot life of 30 minutes. It should not be mixed until ready to use.
  2. To use Circuit Bond, remove the plastic clip separating the resin and hardener. Squeeze back and forth from one half of the package to the other to mix the contents.
  3. Cut a corner off the package and squeeze all the contents into a Plastic Cup. Stir the contents to ensure it is thoroughly mixed.
  4. NOTE: Circuit Bond may contain bubbles from the mixing process. If needed use a vacuum system to remove bubbles.
  5. If desired Color Agent can be mixed in with Circuit Bond to match surface colors.
  6. Apply using a Foam Swab, Micro Probe or Mixing Stick as required.
  7. Cure Circuit Bond for 24 hours at room temperature or 4 hours at 65°C (150°F).

115-5530 Circuit Track, .005″ x .030″ (.127 mm x .762 mm)

Circuit Tracks are rectangular shaped conductors made of pure copper. The rectangular shape closely conform to the original conductor dimensions

Application: Circuit tracks are use to repair damaged conductors on circuit boards. These rectangular ribbons closely conform to the original conductor dimensions.

B6-652-3535-120 Solder paste Stencil

Flextac stencils are seft-sticking solder paste stencils

Thickness .006″ (0.152 mm)
Aperture .024″ (0.610 mm)
Balls 652
Pitch 1.200 mm
Component 35 mm x 35 mm


B8-141-1834-127 Solder Paste Stencil

Flextac stencils are seft-sticking solder paste stencils

Thickness .008″ (0.203 mm)
Aperture .033″ (0.838 mm)
Balls 141
Pitch .050” (1.27) mm
Component 18 mm x 34 mm

B4-432-4040-127 Solder Paste Stencil

Flextac stencils are seft-sticking solder paste stencils

Thickness .006″ (0.152 mm)
Aperture .025″ (0.635 mm)
Balls 432
Pitch .050” (1.27) mm
Component 40 mm x 40 mm


Flextac Solder Paste Stencils have a fill-release, residue-free adhesive on the back side of the stencil. The adhesive ensures a seal around each pad to prevent solder paste from bleeding under the stencil when the paste is applied